Semiconductor backend services encompass a range of critical processes essential for transforming silicon wafers into functional and reliable semiconductor devices. These services start with wafer testing and probing, which involve identifying and sorting defective dies to ensure only the highest quality components proceed. Following this, wafer dicing precisely separates individual dies using mechanical or laser methods, ensuring minimal damage and high accuracy.

Die bonding is the next crucial step, where individual semiconductor dies are attached to substrates or packages with precision to ensure proper alignment and attachment. Wire bonding follows, establishing electrical connections through advanced techniques like ball bonding or wedge bonding, ensuring robust and reliable connections.